华为、小米、荣耀等主流手机品牌于9月1日进行集体调价，其中华为Mate 80系列、小米17系列、荣耀Power2等产品均在此列1。同一天，苹果CEO蒂姆·库克发布告别信宣布卸任，他在信中表示"明天我的头衔会变，但我对Apple社区的热爱永远不会改变"1。约翰·特努斯将接任苹果CEO一职，库克转任董事会执行主席1。
在国内市场方面，网易与华为展开深度合作，全系列产品陆续登陆华为鸿蒙HarmonyOS NEXT系统1。网易云音乐鸿蒙尝鲜版9.5.80已上架，由华为与网易共同开发1。此外，国内首部AIGC长剧《后西游记》于8月31日开播，采用"边审边播"模式1。
政策层面，国家标准《智能网联汽车自动驾驶系统安全要求》(GB 44721-2026)正式文件已出炉，将于2027年7月1日实施1。财务方面，华为投资控股2026年上半年营收达4678.19亿元，同比增长约9.5%；净利润为234.28亿元1。芯片领域，长鑫存储已启动HBM3E内存风险试产，有望数周内实现大规模量产1。此外，燧原科技科创板IPO发行价格定为142.18元/股，预计募集资金总额61.19亿元1。
Chinese tech giants made significant moves on September 1, 2026, with Huawei's Mate 80 series, Xiaomi's 17 series, and Honor's Power2 among nine devices undergoing price adjustments that day.1 The shifts reflect broader industry competition and product lineup updates across major smartphone manufacturers.
Tim Cook marked his final day as Apple CEO with a farewell message to employees, stating: "Tomorrow my title will change, but my love for the Apple community will never waver."1 John Ternus will assume the position of CEO, while Cook transitions to executive chairman of the board.1
Domestically, NetEase has achieved a major milestone in platform integration, with its full product suite debuting on Huawei's HarmonyOS NEXT system.1 NetEase Cloud Music's HarmonyOS trial version 9.5.80 is already available for download, developed jointly by Huawei and NetEase.1
On the automotive front, China has formalized safety standards for autonomous driving. The national standard "Safety Requirements for Intelligent Connected Vehicle Autonomous Driving Systems" (GB 44721-2026) was officially released and will take effect on July 1, 2027.1
Additional developments included Huawei Investment and Holding reporting first-half 2026 revenue of 467.819 billion yuan, representing a 9.5 percent year-over-year increase, with net profit reaching 23.428 billion yuan.1 China's first AI-generated long-form drama series, "After the Journey to the West," premiered on August 31 under a "concurrent review and broadcast" model.1 Changshu Storage has initiated risk production of HBM3E memory and is expected to achieve large-scale manufacturing within weeks.1
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